Flashless lead frame with horizontal singulation

ABSTRACT

A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segments. The apparatus applies a downward force to the lead frame segments and translates the downward force to a horizontal force applied to the tie bars. The singulation process confines movement of the lead frame metal to within the plane of the lead frame.

FIELD OF THE INVENTION

The present invention relates to lead frames for semiconductor packages, more particularly to the separation of one or more such packages from a common lead frame.

BACKGROUND

Typical processing of an integrated circuit produces an encapsulated package within which an IC die is supported by a die pad, with bond wires connected from bond pads disposed on the die to respective leads that extend externally from the encapsulated package. A generally planar, metal strip with patterned openings is used as a lead frame upon which several IC packages will be fabricated and thereafter separated from the lead frame. FIG. 1 is a perspective view of a portion of a typical lead frame 10 for one IC package prior to formation of the package. The dashed line block 12 circumscribes a portion of the metal strip that will be part of the package after completion of the process, including a die pad 14 and individual leads 16. The die pad is shown attached to the periphery of the lead frame by tie bars 20, which contain notches 22. The IC package is fabricated by adhesively mounting a die to the die pad, forming bonding connections between individual bond pads on the die and respective leads 16, and applying a molding compound to encapsulate the die pad, bond wires and leads substantially within the area defined by block 12. Thereafter, leads are detached from the common connection with the lead frame and further processed to obtain desired lead configurations. At this stage, the encapsulated package remains attached to the lead frame periphery by tie bars 20.

With standard methodology, separation of the encapsulated semiconductor package from the lead frame, commonly termed “singulation,” is achieved using tools that apply load directly to the package. The lead frame periphery is clamped and forced to separate from the package by thrust of a punch. The punch tends to force the package out of the plane of the supporting members, thus placing the connecting tie bar metal in tension. The deformed metal reaches its ultimate strength until a break occurs at notches 22. The forces applied to the package create a moment directly related to the application of the force. This moment can be devastating to the molded unit, resulting in silicon die cracking and/or plastic package cracking.

An additional problem encountered with conventional singulation techniques is the formation of “flash.” Flash is the result of the plastic molding operation. Due to tooling tolerances, the lead frame must maintain a distance from the edge of the molded unit to the singulation paring line. Flash is the plastic material that is trapped around the separation area of the lead frame. Plastic molding material protrudes from the package ends with varying degrees of distance. The presence of flash raises concerns that must be addressed in the methods of delivery of IC packages. Typical delivery methods include “tape and reel” delivery and “tube” delivery. With tape and reel delivery, units are placed into a pocket which is then sealed by tape. The size of the pocket must be chosen to accommodate all molded unit packages. Since flash tends to vary in a random fashion, large pockets must be provided. A tube delivery system transports a plurality of IC packages in each tube. A “shingling” problem often occurs as a result of flash interaction between adjoining packages, wherein the units are wedged in place within the tube. Safe and expedient removal of the packages from the tube becomes a difficulty.

The need thus exists for a singulation method and apparatus that avoid damaging the semiconductor packages, eliminate flash, and for an improved lead frame configuration that is compatible with such method and apparatus.

DISCLOSURE OF THE INVENTION

The present invention fulfills the above-described needs of the prior art at least in part by avoiding the bending moment force incident to conventional singulation techniques. A lead frame is appropriately configured for use with the apparatus of the invention and for elimination of flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segments. The apparatus appropriately applies a force to the lead frame segments for separation of the tie bars from the package during singulation, while confining movement of the lead frame metal to within the plane of the lead frame.

The apparatus advantageously includes a generally planar supporting platform having a cavity recessed for accommodating a portion of an encapsulated semiconductor package when the lead frame and semiconductor package are placed on a surface of the platform. A slot in the supporting platform is separated from the cavity by an intermediate portion of the platform. Lead frame segments connected between the lead frame periphery and the semiconductor package overlay the intermediate portion and the slot. A clamping platform having a vertical slot extending therethrough is aligned with the slot in the supporting platform when the clamping platform is appropriately positioned on the supporting platform, with the lead frame and attached semiconductor package positioned therebetween. A surface of the clamping platform that mates with the supporting platform comprises a recess generally conforming to and aligned with the cavity in the supporting platform, so that the encapsulated package is encompassed within the space created by the clamping platform recess and the supporting platform cavity. The portion of the clamping platform between the recess and the slot is recessed from the surface to a lesser degree.

A punch instrument, configured to conform with the slot in the mounting platform, can be thrust downwardly to separate the lead frame segments from the semiconductor package. The punch instrument preferably is joined to a thrusting platform that is slidably engageable with the clamping platform in a direction perpendicular to the plane of the lead frame. The slot in the supporting platform is generally parallel to a sidewall of the cavity, the intermediate portion surface therebetween forming a rib for supporting the lead frame segments that are to be separated from the semiconductor package. A similar slot may be provided parallel and adjacent to an opposite sidewall of the cavity for separating lead frame segments on the other side of the semiconductor package. The clamping and thrusting platforms are provisioned with respect to the second slot in similar fashion; the arrangement can be replicated to accommodate a plurality of semiconductor devices that are connected to the lead frame. Thus, the supporting platform may comprise a plurality of cavities, a pair of slots adjacent each cavity, the mounting platform having a plurality of slots for alignment with the slots in the supporting platform, and the thrusting platform is provide with a plurality of punches, whereby a plurality of semiconductor packages can be severed simultaneously from a single lead frame. Preferably, the cavities are configured in the supporting platform in an array of rows, each row comprising a plurality of cavities. A substructure upon which the supporting platform can be removably placed is configured with rows of recesses that are aligned respectively with the rows of the cavities in the supporting platform. Semiconductor packages that are separated from the lead frame are deposited in corresponding recesses of the substructure.

Additional advantages of the present invention will become readily apparent to those skilled in this art from the following detailed description, wherein only the preferred embodiment of the invention is shown and described, simply by way of illustration of the best mode contemplated of carrying out the invention. As will be realized, the invention is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, all without departing from the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawing and in which like reference numerals refer to similar elements and in which:

FIG. 1 is a perspective view of a portion of a typical lead frame for an IC package.

FIG. 2 is a perspective view of a portion of a lead frame in accordance with the present invention.

FIG. 3 is a perspective view of the lead frame portion of FIG. 2 with the encapsulation package shown transparently.

FIG. 4 is a perspective view of the lead frame portion of FIG. 2 after the leads have been separated from the lead frame.

FIG. 5 is a perspective view of a singulation apparatus in accordance with the present invention.

FIG. 6 is a perspective view of a supporting platform component of the apparatus of FIG. 5.

FIG. 7 is a perspective view of the supporting platform of FIG. 6 having placed thereon a lead frame in accordance with the present invention.

FIG. 8 is a partial perspective view of the apparatus of FIG. 5.

FIG. 9 is a perspective view of a substructure of the apparatus of FIG. 5.

DETAILED DESCRIPTION OF THE INVENTION

A lead frame 10 in accordance with the present invention is shown in FIG. 2. While only a single semiconductor package frame portion is shown, the configuration is replicated on a single metal strip to accommodate a plurality of semiconductor packages as described below. Die pad 14 is attached to opposite sides 24 of the lead frame by tie bars 20 via peripheral portions. Each peripheral portion comprises cutout sections, or openings 26, and lead frame segments 28 that bridge the openings between outer peripheral portion 18 and inner peripheral portion 19. The lead frame segments are substantially in alignment with the tie bars and separated therefrom by the peripheral portions 19. The semiconductor encapsulation, which is formed before the leads are separated processed, is bounded as shown in transparency in FIG. 3. The encapsulated package 32 extends above and below the lead frame by substantially the same distance. FIG. 4 depicts the lead frame after the leads 16 have been detached and processed. The encapsulated package, other than the lead frame, has been deleted for clarity of illustration.

At this stage, the package is attached to the lead frame only by the notched tie bars 20 and only singulation is required to complete the package process. Apparatus for performing singulation according to the present invention is shown in the three-dimensional perspective view of FIG. 5. The apparatus comprises a lower section 40 and an upper section 60. Support platform 42 of the lower section is removably coupled with the substructure 52 in the position shown. Lead frame 10, to which are attached a plurality of encapsulated packages, is supported by the support platform, which is shown in more detail in FIG. 6. Substructure 52 is shown in more detail in FIG. 9.

In upper section 60, clamping platform 62 is slidably engageable with thrusting platform 80 by means of spring loaded guides 64. A plurality of vertically oriented slots 66 extend from upper surface 68 of clamping platform 62 to the lower surface 70, shown in FIG. 8. Extending downwardly from the thrusting platform are a plurality of punch instruments equal in number to the number of slots 66. The punch instruments are vertically aligned with the slots 66 and configured to fit within, and extend beyond, the slots when the lower thrusting platform is moved downwardly to fully engage clamping platform 62.

The support platform 42, shown in FIG. 6, has a generally planar upper surface 43. An array of slots 44 and cavities 46 are provided for supporting a lead frame having six encapsulated IC packages attached thereto. Each cavity 46 is separated from a slot 44 on opposites sides by an intermediate support portion 48 for accommodating one of the encapsulated packages of the lead frame. The upper surface of the intermediate portion is in the plane of surface 43. Holes 50 are provided for aligning support platform 42 of lower section 40, with a lead frame 10 and clamping platform 62 of upper section 60.

The lower surface 70 of clamping platform 62 can be seen in FIG. 8. Six recesses 72 conform in perimeter, and are aligned, with the corresponding cavities 46 in the supporting platform. The recesses are sufficiently deep to provide enough space encompass the portions of the encapsulated packages that are above the plane of the lead frame. The portions 74 of the clamping platform that are between the recesses and slots also are recessed from the surface 70. Substructure 52 contain three channels 54, as seen more clearly in FIG. 9. Each channel is aligned with a pair of cavities 46 in the support platform and serves as a repository for the IC packages after singulation has been completed.

In the singulation operation, the lead frame 10 is placed, with the encapsulated IC packages attached, on the supporting platform 42 as shown in FIG. 7. Each encapsulated package 32, and its associated leads 16, overlays a cavity 46 without contact with surface 43 of the support platform. The bulk of each encapsulation package that is below the plane of lower surface of the lead frame extends into a respective cavity. The lead frame is in contact with the support platform except for the lead frame segments 28 that overlay the slots 44. The tie bars 20 on opposite sides of each package are in contact with, and supported by, the intermediate portions 48 of the support platform.

The upper section 60 is then mounted on the support platform and aligned therewith so that slots 66 overlay slots 44 and recesses 72 overlay cavities 46. The lead frame is clamped between the platform 62 of the upper section and the support platform 42. Platform 80 is then thrust downwardly to drive the punch instruments 82 through the aligned slots 66 in clamping platform 62 to impose a downward force on the lead frame segments 20 simultaneously on both opposite sides of the packages. As the tie bars are supported by intermediate portions 48 of the support platform, the downward force creates a horizontal force on the tie bars, which is sufficient to cause separation of the tie bars from the encapsulated packages at the notches 22. Horizontal movement of the tie bars is not impeded by the clamping platform due to the recesses 74 in the surface 70. The packages are then completely detached from the lead frame and are individually deposited in the channels 54 of substructure 52.

Singulation has been achieved without imposition of bending forces on the packages that can cause damage. As there is no protrusion of molding material from the package ends, flash has been eliminated.

In this disclosure there are shown and described only preferred embodiments of the invention and but a few examples of its versatility. It is to be understood that the invention is capable of use in various other combinations and environments and is capable of changes or modifications within the scope of the inventive concept as expressed herein. 

1. Apparatus for separating a semiconductor package from a lead frame attached thereto by tie bars, said apparatus comprising: a generally planar supporting platform having a cavity and a slot separated from the cavity by an intermediate portion of the platform for supporting the lead frame when the lead frame and semiconductor package are placed on a surface of the platform, the cavity being dimensioned to encompass the semiconductor package, with lead frame segments overlaying the slot; a clamping platform for clamping the lead frame to the supporting platform when mounted thereon, the clamping platform having a slot therethrough that is aligned with the slot in the supporting platform; and means for separating the tie bars from the semiconductor package in a direction parallel to the surface of the supporting platform.
 2. Apparatus for separating a semiconductor package from a lead frame attached thereto by tie bars, said apparatus comprising: a generally planar supporting platform having a cavity and a slot separated from the cavity by an intermediate portion of the platform for supporting the lead frame when the lead frame and semiconductor package are placed on a surface of the platform, the cavity being dimensioned to encompass the semiconductor package, with lead frame segments overlaying the slot; a clamping platform for clamping the lead frame to the supporting platform when mounted thereon, the clamping platform having a slot therethrough that is aligned with the slot in the supporting platform; and a thrusting platform slidably engageable with said clamping platform.
 3. Apparatus as recited in claim 2, further comprising a a punch attached to said thrusting platform for separating the tie bars from the semiconductor package in a direction parallel to the surface of the supporting platform.
 4. Apparatus as recited in claim 3, wherein the slot in the supporting platform is generally parallel to a first sidewall of the cavity and the supporting platform further comprises a second slot generally parallel to a second sidewall of the cavity.
 5. Apparatus as recited in claim 4, wherein said clamping platform further comprises a second slot that is aligned with the second slot in the supporting platform when the clamping platform is mounted on the supporting platform, and the thrusting platform comprises a second punch configured to conform with the second slot in the clamping portion.
 6. Apparatus as recited in claim 4, wherein said clamping platform further comprises a recess generally conforming with and aligning with the cavity in the supporting platform.
 7. Apparatus as recited in claim 4, wherein said supporting platform comprises a plurality of said cavities, a pair of slots adjacent each cavity, said clamping platform comprises a plurality of slots for alignment with the slots in the supporting platform, and said thrusting platform comprises a plurality of punches, whereby a plurality of semiconductor packages can be singulated simultaneously from a single lead frame.
 8. Apparatus as recited in claim 7, wherein said cavities are configured in the supporting platform in an array of rows, each row comprising a plurality of cavities, and said apparatus further comprises a substructure upon which the supporting platform is removably coupled, said substructure comprising channels that are aligned respectively with the rows of the cavities in the supporting platform, whereby semiconductor packages that are separated from the lead frame are deposited in the recesses of the substructure.
 9. A method for separating an encapsulated semiconductor package from a lead frame attached thereto by tie bars, the method comprising the steps of: clamping the lead frame between two planar surfaces; supporting the tie bars at locations proximate to the encapsulated package; applying a thrusting force to peripheral lead frame segments in a direction perpendicular to the plane of the surfaces, thereby separating the tie bars from the semiconductor package in a direction parallel to the plane of the surfaces.
 10. A method as recited in claim 9, wherein the clamping step comprises the steps of: placing the lead frame with attached semiconductor package on a supporting platform having a cavity for containing a portion of the semiconductor package, the peripheral lead frame segments positioned over a slot in the supporting platform and the tie bars positioned over an intermediate portion of the supporting frame proximate the cavity; and mounting a slotted platform on the lead frame and the supporting platform so that a slot in the slotted platform is aligned with a slot in the supporting platform.
 11. A method as recited in claim 10, wherein said applying step comprises the steps of: inserting a punch instrument into the slot in the slotted platform; and forcibly advancing the punch instrument through the lead frame segments and into the slot in the supporting platform.
 12. A method as recited in claim 10, wherein said supporting platform comprises a pair of slots adjacent respective sidewalls of the cavity corresponding to locations of lead frame segments on first and second sides of the semiconductor package to be separated, and said applying step comprises simultaneously forcibly advancing a plurality of punch instruments in slots in said slotted platform to the lead frame segments.
 13. A method as recited in claim 12, wherein the plurality of punch instruments are mounted on a common member and said step of forcibly advancing comprises mating the common member with the slotted platform. 14-15. (canceled)
 16. Apparatus for separating a semiconductor package from a lead frame attached thereto by lead frame segments, said apparatus comprising: a supporting platform, having a cavity and a slot separated from the cavity, for supporting the lead frame with a lead frame segment overlaying the slot; a clamping platform, having a slot therethrough, for clamping the lead frame to the supporting platform when mounted thereon with the clamping platform slot aligned with the slot in the supporting platform; and a thrusting device engageable with the slot in the clamping platform to separate said lead frame segment from the semiconductor package in a direction parallel to the surface of the supporting platform.
 17. Apparatus as recited in claim 16, wherein the cavity is dimensioned to encompass the semiconductor package.
 18. Apparatus as recited in claim 16, wherein said clamping platform comprises a plurality of slots that is aligned with a plurality of slots in the supporting platform when the clamping platform is mounted on the supporting platform, and the thrusting device is engageable with each of the slots in the clamping platform to separate a plurality of lead frame segments from the semiconductor package in a direction parallel to the surface of the supporting platform.
 19. A method for separating a semiconductor package from a lead frame attached thereto by lead frame segments, the method comprising the steps of: clamping the lead frame between two planar surfaces; supporting the lead frame segments at locations proximate to the encapsulated package; and applying a thrusting force to the lead frame segments to separate the lead frame segments from the semiconductor package in a direction parallel to the planes of the surfaces. 